JPH039343Y2 - - Google Patents
Info
- Publication number
- JPH039343Y2 JPH039343Y2 JP17095486U JP17095486U JPH039343Y2 JP H039343 Y2 JPH039343 Y2 JP H039343Y2 JP 17095486 U JP17095486 U JP 17095486U JP 17095486 U JP17095486 U JP 17095486U JP H039343 Y2 JPH039343 Y2 JP H039343Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit
- land
- hole
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 48
- 239000004020 conductor Substances 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17095486U JPH039343Y2 (en]) | 1986-11-07 | 1986-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17095486U JPH039343Y2 (en]) | 1986-11-07 | 1986-11-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377379U JPS6377379U (en]) | 1988-05-23 |
| JPH039343Y2 true JPH039343Y2 (en]) | 1991-03-08 |
Family
ID=31106144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17095486U Expired JPH039343Y2 (en]) | 1986-11-07 | 1986-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH039343Y2 (en]) |
-
1986
- 1986-11-07 JP JP17095486U patent/JPH039343Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6377379U (en]) | 1988-05-23 |
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